Our nanocopper material offers significant electrical & thermal conductivity benefits compared to solder. The technology is covered by an extensive patent portfolio. In addition to our core products listed below, we work closely with our customers to optimize our solutions to your needs.

Key features:

  • Pressure-less sintering as low as 200°C
  • Complete decoupling of processing and operating temperature 
  • Up to 7 times higher electrical and thermal conductivity than solder

Kuprion NSA-16 nanocopper paste demonstration