About Kuprion

Kuprion, located in Northern California’s Silicon Valley, a prominent hub for technology and innovation, specializes in the formulation, manufacture and engineering of copper materials for high-power electronics. With over 20 patents worldwide, Kuprion delivers innovative copper material solutions that improve thermal performance and reliability, enabling a new paradigm in the design and manufacture of durable RoHS compliant interconnections.

Kuprion’s ActiveCopper™ materials are used in electronics assembly to solve thermal related reliability issues in advanced high-power electronics that operate at high-temperatures or in environments with extreme temperature fluctuations. Our tunable CTE ActiveCopper™ materials are formulated for optimal performance and reliability even when matched with mixed materials such as ceramics, FR4, silicon, silicon carbide (SiC), gallium nitride (GaN), and more. And they are 100% REACH and RoHS compliant, making them excellent alternatives to lead-based solders.

History

Today, with rapidly growing numbers of patents and fortune 100 customers, Kuprion is a technology leader providing innovative material solutions, enabling electronics engineers and manufacturers in a variety of industries to manage heat in high-power, high-temperature electronic systems for improved performance and reliability.

2022, Kuprion expanded its family of high-performance, cost-effective ActiveCopper™ materials to include solutions for advanced semiconductor packaging, electric vehicles and 5G communication.

2021, Kuprion announced a major milestone, tunable CTE ActiveCopper™ formulations with CTE ranging from 3ppm to 17ppm and higher.

2020, Kuprion opened its new headquarters and manufacturing facility in San Jose, California.

2019, Kuprion received series A funding from Alsop Louie Partners, Dolby Family Ventures, and LiteCap.

2016, Kuprion was founded by Dr. Alfred Zinn. Kuprion was spun out of Lockheed Martin to commercialize one of the most significant advancements in electronic materials and printable conductive inks of our generation, ActiveCopper™.

2008-2016, Dr. Alfred Zinn, a Fellow at Lockheed Martin recognized for his role of technical excellence and leadership in driving innovation, led the development of ActiveCopper™, a high-performance, highly reliable copper interconnect and adhesive material for use in electronics.

2006-2008, Restrictions of Hazardous Substances (RoHS) banned the use of certain hazardous substances including lead-based solder, in electrical and electronic equipment (with exceptions) in Europe, the USA, China, South Korea, and Japan. This directive triggered global corporate research and development initiatives for alternative materials.

Facility

Kuprion’s facility is designed to meet the highest quality standards. Equipped for materials science research, new product development and the validation of materials and processes, our facility supports the development of novel copper materials for easy dispensing, die attach, printing, curing and sintering using standard electronics manufacturing equipment.