A flowable copper “metal-adhesive” with superior thermal and electrical performance.
As featured in
Excellent Alternative to Solder
CuantumFuseTM is an excellent alternative to lead- and lead-free solders, AuSn and nanosilver for general surface-mount bonding applications (SMT). Pressureless sintering at 195°C to 240°C yields bulk copper joints.
Superior Thermal Performance
CuantumFuseTM exhibits thermal conductivity of 240-280 W/m K, 60% - 70% of bulk copper. Our customer reduced their LED system thermal resistance by up to 25% using CuantumFuseTM in place of AuSn. Performance improves with increasing current load.
Improved Electrical Performance
CuantumFuseTM achieves electrical conductivity of 35% to 70% of bulk copper. That’s 3-7 times the conductivity of traditional lead and lead-free solders. The end-to-end resistance of a resistance pattern shown on the right (1mm wide, 6cm long, 10 microns thick) printed with CuantumFuseTM is 1.9Ω.
Compatible with Various Materials
CuantumFuseTM is capable of bonding to Cu, Ag, Au, ENEPIG, OSP, Sn and SAC. In each of the pictures below, Kuprion's CuantumFuseTM nanocopper paste (the thin layer of pink material) is used to bond two parts plated with the same material. These parts are plated with either Ag, Au, Cu or Sn.
Fused CuantumFuseTM is 100% copper, making it fully compliant with the EU’s Restriction of Hazardous Substances (RoHS), which bans the use of lead, mercury, cadmium, polybrominated biphenyls, and polybrominated diphenyl ethers in electrical and electronic products.
Compatible with Solder
CuantumFuseTM is compatible with solder, enabling maximum flexibility with legacy processes. The coaxial cable (pictured) is soldered to the CuantumFuseTM antenna.
No-clean material system
All additives in CuantumFuseTM evaporate during sintering, leaving no residue.
Customizable to Your Needs
Kuprion’s nanocopper technology is versatile and suited for use in multiple industries. We are dedicated to creating the perfect interconnect material for your application.