Today’s innovations begin with the latest technological advancements. Kuprion’s innovative ActiveCopper™ sintering pastes, adhesives, inks and gaskets are game changers for demanding applications, enabling significant advancements in thermal performance, power densities, operational efficiencies and long-term reliability.
Kuprion’s ActiveCopper™ die attach pastes are flowable copper metal adhesives that provide superior thermal and electrical performance. They are excellent alternatives to lead- and lead-free solders, AuSn solder and nanostructured silver for high-power semiconductor applications such as high-power transistors, MOSFETs and IGBTs. With tunable CTE they can be formulated to match Si, SiC and GaN semiconductor materials.
Kuprion’s engineered copper pastes for fine pitch micro-bumping and pillars replace traditional ball grid array (BGA) solder bumps and column grid array (CGA) interconnects. Kuprion’s engineered copper pastes are compatible with standard surface mount technologies (SMT) including flip chip and allow increased I/O densities, higher operating temperatures and long-term durability.
Copper via fill is ideal for PCB designs that must transfer high amounts of heat or current from one side of the board to another. Our copper via fill materials are ideal for high RF or high-power electronics and are especially useful to dissipate heat from underneath chips where heat sinks or other conventional methods are impractical. Kuprion’s copper via fill materials exhibit extremely high conductivity, up to 393 W/mK and can be tuned to match CTE of surrounding conductive and laminate materials.
Kuprion’s sprayable aerosol and printable conductive copper inks are used to fabricate conductive traces on flexible or uniquely shaped substrates. They exhibit high electrical and thermal conductivity, are easy to solder to and are RoHS compliant making them excellent alternatives to silver inks. Our conductive inks can be cured in 5 to 8 minutes in an inert gas oven or instantaneously by laser irradiation or photo-sintering.
Originally developed for use in spacecraft where small size and durability are paramount, multi-layer ceramic capacitors (MLCCs) achieve high capacitance in small areas. Constructing MLCCs requires advanced nanotechnology to achieve thinness of alternating layers of dielectric and internal electrode sheets in the range of one micron. Kuprion’s ActiveCopper™ sintering materials can be screen printed to the utmost thinness to create a rugged stack for long-term reliability in operating temperatures up to 200°C. Our CTE matching formulations improve mechanical and thermal performance for the most demanding applications.
Kuprion’s engineered copper adhesives offer superior thermal management for heat-generating components. Ideal for bonding heat sinks to IC packages and ceramic substrates without the use of thermal grease or mechanical fasteners. Also effective in heat spreader and heat pipe assemblies, our thermally conductive copper adhesives are RoHS compliant and CTE tunable for best-in-class thermal management capabilities.
DBC AlN, copper foil bonded to aluminum nitride, is an important packaging technology for the automotive and aerospace industries due to its high current carrying capacity and high thermal conductivity. However, it suffers from expensive, high temperature processing (around 1000°C) to firmly adhere the copper foil to AlN. And the high CTE mismatch between Cu (17 ppm) and AlN (4.2 ppm) can lead to cracking on cool-down. Kuprion’s CTE matching ActiveCopper™ DBC AlN solution fixes this issue, bonding directly to AlN and other ceramics at temperatures below 250°C, enabling superior performance and lower cost.
The combination of miniaturization, package-level integration and high frequency RF has given rise to the need for new EMI shielding solutions. Kuprion’s innovative copper shielding ink is sprayable, easily applied to metals, plastics and paper and is an excellent alternative to EMI cans, sputtering or sprayable silver inks. Applied as an ultra-thin (1-50 microns) copper coating over our proprietary adhesion promoter with standard spray coating equipment, our EMI conformal coating cures in minutes to provide high shielding effectiveness (Mhz to Ghz) and reliability with low implementation costs.
Copper is a popular gasket material for several reasons. It is compatible with many different fluids and materials. It is strong and malleable enough to nest into contact faces, providing an excellent seal when tightened, and it is stable at high temperatures. Kuprion’s engineered copper gasketing material is easily dispensed and cured for high-volume production and is CTE tunable for superior thermal and mechanical performance in the most demanding environments.
