“Kuprion commercializes a novel nano-copper-based material, substantially oxygen-free that exhibits excellent Aerosol Jet printability and can be fused to solid bulk copper in a few minutes at temperatures as low as 200°C. The resulting traces show high thermal and electrical conductivity approaching that of bulk copper. The nano-copper paste & ink can be readily tailored regarding metal load (can exceed 50% w/w), viscosity and use of carrier solvent. Line-widths as narrow as 25 micron and one pass layer thicknesses ranging from 250 nm to 60 micrometer have been demonstrated using Optomec’s Aerosol Jet printing technique. Further optimization efforts are underway for additive manufacturing applications.” said Alfred Zinn, CEO, Kuprion, Inc.