Our nanocopper material offers significant electrical & thermal conductivity benefits compared to solder. The technology is covered by an extensive patent portfolio. Kuprion offers a variety of pastes and inks, below are a couple of our offerings. Kuprion works closely with our customers to optimize our solutions to fit your needs.

Key features:

  • Pressure-less sintering as low as 200°C

  • Complete decoupling of processing and operating temperature

  • Up to 7 times higher electrical and thermal conductivity than solder


Kuprion NSA-16 nanocopper paste demonstration